Label and body marking of C8D20DS29D1 can be provided after order.
In stock: 57434
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Standard Packaging Integrated Circuit Components C8D20DS29D1
Termination | Solder |
---|---|
Series | Cantilever |
Read Out | Dual |
Pitch | 0.100" (2.54mm) |
Packaging | Bulk |
Other Names | 6-1437275-9 6-1437275-9-ND |
Operating Temperature | -55°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | - |
Number of Positions | 40 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Thermoplastic, Glass Filled |
Manufacturer Standard Lead Time | 13 Weeks |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Gender | Female |
Flange Feature | Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia |
Features | - |
Contact Type | Cantilever |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.054" ~ 0.071" (1.37mm ~ 1.80mm) |