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Standard Packaging Integrated Circuit Components PL-2-3-254-H
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0790" (2.007mm) |
Thermal Resistivity | - |
Thermal Conductivity | 3.0 W/m-K |
Shape | Square |
Series | ulTIMiFlux™ |
Outline | 25.40mm x 25.40mm |
Other Names | 345-1513 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Silicone Elastomer |
Manufacturer Standard Lead Time | 6 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Green 25.40mm x 25.40mm Square Tacky - One Side |
Color | Green |
Backing, Carrier | - |
Adhesive | Tacky - One Side |