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Standard Packaging Integrated Circuit Components IRF3709ZSPBF
Vgs(th) (Max) @ Id | 2.25V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | D2PAK |
Series | HEXFET® |
Rds On (Max) @ Id, Vgs | 6.3 mOhm @ 21A, 10V |
Power Dissipation (Max) | 79W (Tc) |
Packaging | Tube |
Package / Case | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
Other Names | *IRF3709ZSPBF SP001551038 |
Operating Temperature | -55°C ~ 175°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 2130pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs | 26nC @ 4.5V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | N-Channel 30V 87A (Tc) 79W (Tc) Surface Mount D2PAK |
Current - Continuous Drain (Id) @ 25°C | 87A (Tc) |