In stock: 57212
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Standard Packaging Integrated Circuit Components D10850-40
Width | 0.850" (21.59mm) |
---|---|
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | 20.00°C/W @ 100 LFM |
Shape | Square, Pin Fins |
Series | Deltem™ |
Power Dissipation @ Temperature Rise | 2.5W @ 90°C |
Package Cooled | BGA |
Other Names | 345-1077 D1085040 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material Finish | - |
Material | Composite |
Manufacturer Standard Lead Time | 12 Weeks |
Length | 0.850" (21.59mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.400" (10.16mm) |
Diameter | - |
Detailed Description | Heat Sink BGA Composite 2.5W @ 90°C Top Mount |
Attachment Method | Thermal Tape, Adhesive (Not Included) |