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Standard Packaging Integrated Circuit Components 10058831-110LF
Termination | Press-Fit |
---|---|
Series | HPCE® |
Read Out | Dual |
Pitch | 0.029" (0.75mm) |
Packaging | Tray |
Other Names | 10058831110LF 609-3134 |
Operating Temperature | -40°C ~ 85°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 85 |
Number of Positions | 170 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyamide (PA), Nylon |
Manufacturer Standard Lead Time | 9 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | Board Guide |
Contact Type | Cantilever |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | MicroTCA™ |
Card Thickness | 0.062" (1.57mm) |