Label and body marking of HMC30DTEF can be provided after order.
In stock: 52554
We are stocking distributor of HMC30DTEF with very competitive price. Check out HMC30DTEF newest pirce, inventory and lead time now by using the quick RFQ Form. Our commitment to quality and authenticity of HMC30DTEF is unwavering, and we have implemented stringent quality inspection and delivery processes to ensure the integrity of HMC30DTEF. You can also find HMC30DTEF Datasheet here.
Standard Packaging Integrated Circuit Components HMC30DTEF
Termination | Solder Eyelet(s) |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.100" (2.54mm) |
Packaging | Tube |
Operating Temperature | -65°C ~ 125°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 30 |
Number of Positions | 60 |
Mounting Type | Panel Mount |
Material - Insulation | Polybutylene Terephthalate (PBT) |
Manufacturer Standard Lead Time | 5 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia |
Features | - |
Contact Type | Full Bellows |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Blue |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |