Label and body marking of JBB75DYFD can be provided after order.
In stock: 58372
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Standard Packaging Integrated Circuit Components JBB75DYFD
Termination | Solder |
---|---|
Series | - |
Read Out | Dual |
Pitch | 0.050" (1.27mm) |
Packaging | Tube |
Operating Temperature | -65°C ~ 150°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 75 |
Number of Positions | 150 |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyamide (PA9T), Nylon 9T |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia |
Features | - |
Contact Type | Cantilever |
Contact Material | Beryllium Copper |
Contact Finish Thickness | 10.0µin (0.25µm) |
Contact Finish | Gold |
Color | Black |
Card Type | Non Specified - Dual Edge |
Card Thickness | 0.062" (1.57mm) |