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Standard Packaging Integrated Circuit Components PC96-288-192-1.0
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0390" (0.991mm) |
Thermal Resistivity | - |
Thermal Conductivity | 2.5 W/m-K |
Shape | Rectangular |
Series | PC96 |
Outline | 288.00mm x 192.00mm |
Other Names | 1168-2142 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Non-Silicone |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad 288.00mm x 192.00mm Rectangular |
Color | - |
Backing, Carrier | - |
Adhesive | - |