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Standard Packaging Integrated Circuit Components SI3590DV-T1-GE3
Vgs(th) (Max) @ Id | 1.5V @ 250µA |
---|---|
Supplier Device Package | 6-TSOP |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 77 mOhm @ 3A, 4.5V |
Power - Max | 830mW |
Packaging | Cut Tape (CT) |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Other Names | SI3590DV-T1-GE3CT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 33 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | - |
Gate Charge (Qg) (Max) @ Vgs | 4.5nC @ 4.5V |
FET Type | N and P-Channel |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | Mosfet Array N and P-Channel 30V 2.5A, 1.7A 830mW Surface Mount 6-TSOP |
Current - Continuous Drain (Id) @ 25°C | 2.5A, 1.7A |