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Standard Packaging Integrated Circuit Components THINC33-TO247-28.5-17.5-5.8-0.3
Usage | TO-247 |
---|---|
Type | Interface Cap |
Thickness | 0.0120" (0.305mm) |
Thermal Resistivity | - |
Thermal Conductivity | 1.9 W/m-K |
Shape | Rectangular |
Series | THINC |
Outline | 28.50mm x 17.50mm x 5.80mm |
Other Names | 1168-1957 THINC33-28.5-17.5-5.8-0.3 THINC33TO2472851755803 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Silicone |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 28.50mm x 17.50mm x 5.80mm Rectangular |
Color | Gray |
Backing, Carrier | - |
Adhesive | - |