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Standard Packaging Integrated Circuit Components SI5936DU-T1-GE3
Vgs(th) (Max) @ Id | 2.2V @ 250µA |
---|---|
Supplier Device Package | PowerPAK® ChipFet Dual |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 30 mOhm @ 5A, 10V |
Power - Max | 10.4W |
Packaging | Cut Tape (CT) |
Package / Case | PowerPAK® ChipFET™ Dual |
Other Names | SI5936DU-T1-GE3CT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 27 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 320pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs | 11nC @ 10V |
FET Type | 2 N-Channel (Dual) |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | Mosfet Array 2 N-Channel (Dual) 30V 6A 10.4W Surface Mount PowerPAK® ChipFet Dual |
Current - Continuous Drain (Id) @ 25°C | 6A |