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Standard Packaging Integrated Circuit Components M2S025-1FCS325
Supplier Device Package | 325-BGA (11x11) |
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Speed | 166MHz |
Series | SmartFusion®2 |
RAM Size | 64KB |
Primary Attributes | FPGA - 25K Logic Modules |
Peripherals | DDR, PCIe, SERDES |
Packaging | Tray |
Package / Case | 325-TFBGA |
Operating Temperature | 0°C ~ 85°C (TJ) |
Number of I/O | 180 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Flash Size | 256KB |
Detailed Description | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 25K Logic Modules 256KB 64KB 166MHz 325-BGA (11x11) |
Core Processor | ARM® Cortex®-M3 |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Architecture | MCU, FPGA |