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Standard Packaging Integrated Circuit Components SI7317DN-T1-GE3
Vgs(th) (Max) @ Id | 4.5V @ 250µA |
---|---|
Vgs (Max) | ±30V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | PowerPAK® 1212-8 |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 1.2 Ohm @ 500mA, 10V |
Power Dissipation (Max) | 3.2W (Ta), 19.8W (Tc) |
Packaging | Tape & Reel (TR) |
Package / Case | PowerPAK® 1212-8 |
Other Names | SI7317DN-T1-GE3TR |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 33 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 365pF @ 75V |
Gate Charge (Qg) (Max) @ Vgs | 9.8nC @ 10V |
FET Type | P-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 6V, 10V |
Drain to Source Voltage (Vdss) | 150V |
Detailed Description | P-Channel 150V 2.8A (Tc) 3.2W (Ta), 19.8W (Tc) Surface Mount PowerPAK® 1212-8 |
Current - Continuous Drain (Id) @ 25°C | 2.8A (Tc) |