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Standard Packaging Integrated Circuit Components SI3909DV-T1-E3
Vgs(th) (Max) @ Id | 500mV @ 250µA (Min) |
---|---|
Supplier Device Package | 6-TSOP |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 200 mOhm @ 1.8A, 4.5V |
Power - Max | 1.15W |
Packaging | Tape & Reel (TR) |
Package / Case | SOT-23-6 Thin, TSOT-23-6 |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | - |
Gate Charge (Qg) (Max) @ Vgs | 4nC @ 4.5V |
FET Type | 2 P-Channel (Dual) |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | Mosfet Array 2 P-Channel (Dual) 20V 1.15W Surface Mount 6-TSOP |
Current - Continuous Drain (Id) @ 25°C | - |