In stock: 56062
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Standard Packaging Integrated Circuit Components 10018783-10001TLF
Termination | Solder, Staggered |
---|---|
Series | HPCE® |
Read Out | Dual |
Pitch | 0.039" (1.00mm) |
Packaging | Tray |
Other Names | 609-1961 |
Operating Temperature | -55°C ~ 85°C |
Number of Rows | 2 |
Number of Positions/Bay/Row | 11; 21 |
Number of Positions | 64 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material - Insulation | Polyamide (PA), Nylon, Glass Filled |
Manufacturer Standard Lead Time | 11 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gender | Female |
Flange Feature | - |
Features | Board Guide, Locking Ramp |
Contact Type | Cantilever |
Contact Material | Copper Alloy |
Contact Finish Thickness | 30.0µin (0.76µm) |
Contact Finish | Gold |
Color | Black |
Card Type | PCI Express™ |
Card Thickness | 0.062" (1.57mm) |