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Standard Packaging Integrated Circuit Components AS4C256M8D2-25BIN
Write Cycle Time - Word, Page | 15ns |
---|---|
Voltage - Supply | 1.7 V ~ 1.9 V |
Technology | SDRAM - DDR2 |
Supplier Device Package | 60-FBGA (8x10) |
Series | - |
Packaging | Tray |
Package / Case | 60-TFBGA |
Other Names | 1450-1315 AS4C256M8D2-25BIN-ND |
Operating Temperature | -40°C ~ 95°C (TC) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Memory Type | Volatile |
Memory Size | 2Gb (256M x 8) |
Memory Interface | Parallel |
Memory Format | DRAM |
Manufacturer Standard Lead Time | 8 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | SDRAM - DDR2 Memory IC 2Gb (256M x 8) Parallel 400MHz 57.5ns 60-FBGA (8x10) |
Clock Frequency | 400MHz |
Access Time | 57.5ns |