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Standard Packaging Integrated Circuit Components CAS325M12HM2
Vgs(th) (Max) @ Id | 4V @ 105mA |
---|---|
Supplier Device Package | Module |
Series | Z-REC™ |
Rds On (Max) @ Id, Vgs | 4.3 mOhm @ 400A, 20V |
Power - Max | 3000W |
Packaging | Bulk |
Package / Case | Module |
Operating Temperature | 175°C (TJ) |
Moisture Sensitivity Level (MSL) | Not Applicable |
Manufacturer Standard Lead Time | 52 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Gate Charge (Qg) (Max) @ Vgs | 1127nC @ 20V |
FET Type | 2 N-Channel (Half Bridge) |
FET Feature | Silicon Carbide (SiC) |
Drain to Source Voltage (Vdss) | 1200V (1.2kV) |
Detailed Description | Mosfet Array 2 N-Channel (Half Bridge) 1200V (1.2kV) 444A (Tc) 3000W Module |
Current - Continuous Drain (Id) @ 25°C | 444A (Tc) |