Label and body marking of A17669-008 can be provided after order.
In stock: 2
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Standard Packaging Integrated Circuit Components A17669-008
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0080" (0.203mm) |
Thermal Resistivity | - |
Thermal Conductivity | 3.0 W/m-K |
Shape | Square |
Series | Tflex™ UT20000 |
Outline | 457.20mm x 457.20mm |
Other Names | 926-1789 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Material | Silicone, Ceramic Filled |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 457.20mm x 457.20mm Square |
Color | Gray |
Backing, Carrier | - |
Adhesive | - |