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Standard Packaging Integrated Circuit Components 3MIC 3M662XW TH DISC 2.75"
Weight | - |
---|---|
Type | Lapping Film |
Specifications | Diamond |
Size / Dimension | 2.75" Dia (69.9mm) |
Series | 662XW |
Other Names | 00051111561553 3MIC 3M662XW TH DISC 2.75"-ND 3MIC3M662XWTHDISC2.75" 60020005439 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
For Use With/Related Products | Fiber Optic Connectors |
Detailed Description | Lapping Film Diamond 2.75" Dia (69.9mm) |