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Standard Packaging Integrated Circuit Components .5MIC 3M662XW DLF 3MIL TH 5 IN
Weight | - |
---|---|
Type | Lapping Film |
Specifications | Diamond |
Size / Dimension | 5.00" Dia (127.0mm) |
Series | 662XW |
Other Names | 00051111499696 3M10774 5MIC3M662XWDLF3MILTH5IN 60070008473 7000044833 |
Moisture Sensitivity Level (MSL) | Not Applicable |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
For Use With/Related Products | Fiber Optic Connectors |
Detailed Description | Lapping Film Diamond 5.00" Dia (127.0mm) |