In stock: 81
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Standard Packaging Integrated Circuit Components ED555/11DS
Wire Termination | Screw - Leaf Spring, Wire Guard |
---|---|
Wire Gauge | 16-28 AWG |
Voltage | 150V |
Torque - Screw | 0.4 Nm (3.5 Lb-In) |
Series | ED555/DS |
Screw Thread | M2 |
Screw Material - Plating | - |
Positions Per Level | 11 |
Pitch | 0.138" (3.50mm) |
Packaging | Bulk |
Other Names | ED1523 ED555/11 ED55511DS |
Operating Temperature | -30°C ~ 105°C |
Number of Levels | 1 |
Mounting Type | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Mating Orientation | Horizontal with Board |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Housing Material | Polyamide (PA), Nylon |
Features | - |
Detailed Description | 11 Position Wire to Board Terminal Block Horizontal with Board 0.138" (3.50mm) Through Hole |
Current | 6A |
Contact Material - Plating | Brass |
Color | Gray |
Clamp Material - Plating | Steel, Stainless |