Test Process
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Assessment Test
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Analysis Report
At Mega Source, we are committed to providing the highest-quality and most reliable electronic components to customers worldwide. Our company is equipped with advanced testing facilities and a strict quality control system, supported by multiple international certifications to ensure every product meets the highest industry standards. Our testing and inspection center covers an area of over 1,800 square meters, featuring state-of-the-art equipment that complies with international testing standards.
We are equipped with internationally advanced testing instruments, including X-Ray analyzers, laser decapsulation systems, solderability testers, ultra-depth microscopes, temperature and humidity chambers, and electrical performance testers. These tools enable us to conduct full-process inspections—covering appearance testing, dimensional measurement, solderability evaluation, die analysis, reliability testing, and failure analysis.
With the expertise of our professional technical team and the precision of advanced equipment, Mega Source delivers authoritative and accurate testing results, ensuring each component meets the strictest standards of performance and reliability. This comprehensive approach guarantees consistent quality from the source to final delivery.
MEGA ICs Full-Process Quality Inspection Incude
ICs Full-Process Quality Inspection
At Mega Source, we enforce strict quality control for every IC and electronic component. From outer packaging to internal performance, each IC undergoes meticulous inspection and verification. Leveraging advanced testing equipment and a professional technical team, we can promptly identify potential issues, ensuring the authenticity, performance, and reliability of every IC.
Outer Packaging Inspection
This step verifies the completeness and accuracy of all external packaging information, including manufacturer name, quantity, production date, batch number, and country of origin. Every detail must match the original factory documentation to ensure authenticity and traceability.
Inner Packaging Inspection
The inspection focuses on identifying any signs of moisture, deformation, splicing marks, or material leakage to ensure that the components remain intact and undamaged during transportation and storage. This helps prevent environmental or physical issues that could affect product quality.
Visual & Microscopic Inspection
Visual and microscopic inspections confirm the chip's authenticity and appearance, including dimensions, surface scratches, BGA ball oxidation or damage, and polishing marks. Advanced 2D and 3D imaging systems compare screen printing, font style, and codes with datasheet specifications and manufacturer databases to prevent counterfeit or refurbished products.
Functional & Reliability Testing
At this stage, a series of professional tests are conducted to comprehensively evaluate the authenticity and performance of electronic components:
1. X-Ray Inspection: Analyzes internal structures (lead frame, die size, bonding wires) to detect voids or internal defects.
2. XRF RoHS Testing: Tests for six restricted substances including Pb, Hg, and Cd to ensure RoHS environmental compliance.
3. MCU Programming Verification: Confirms whether the chip has been pre-programmed and remains in its original factory condition.
4. Decapsulation Analysis: Exposes the chip die to verify original markings and ensure authenticity. Solderability Testing: Tests pin plating performance according to J-STD-002B to confirm solder reliability.
5. High-Temperature Aging Test: Evaluates stability and resistance under high temperature and humidity conditions.
6. Ultrasonic Scanning Analysis: Detects internal delamination, cracks, voids, die tilt, or contamination.
7. ESD Testing: Verifies antistatic performance, insulation resistance, and grounding effectiveness to meet ESD standards.
8. Static Parameter Testing: Measures electrical parameters to ensure consistent performance.
9. Impedance Analysis: Checks impedance matching and stability to confirm electrical characteristics meet design requirements.
MEGA LCD Full-Process Quality Inspection
MEGA LCD Full-Process Quality Inspection Incude
At Mega Source, every LCD display undergoes strict full-process quality inspection. We check the outer packaging, appearance, display performance, and more. Multiple checks ensure that each product meets the required specifications.
External Packaging Inspection
Check the barcode label on the LCD packaging to ensure it matches the product specifications. The packaging box must be intact and clean, and different models of the same specification must not be mixed, ensuring safe transportation and storage.
Visual Inspection
Carefully examine the LCD surface for scratches, panel deformation, residual adhesive, aging, irregularities, rust, corrosion, or cracks. Confirm that the screen coating is uniform, without peeling, cracking, or wear. Ensure connector pins are intact and ribbon cables are undamaged.
Lighting and Display Performance Testing
Test the LCD display performance to ensure there are no stains, bright spots, color spots, or white dots, and that the light guide plate and backlight function correctly. Inspect for liquid leakage, screen cracks, sunspots, panel splitting, color anomalies, coating defects, or dents.
More Other Inspections
Additional inspections include an aging test and supplier verification. During the aging test, the screen is kept on continuously for several days to ensure it operates reliably over long periods of use. At the same time, supplier inspection reports are also verified to guarantee data accuracy and traceable quality records.
