In stock: 57980
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Standard Packaging Integrated Circuit Components Q3-0.005-00-90
Usage | TO-218, TO-220, TO-247 |
---|---|
Type | Pad, Sheet |
Thickness | 0.0050" (0.127mm) |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 2.0 W/m-K |
Shape | Rectangular |
Series | Q-Pad® 3 |
Outline | 21.84mm x 18.79mm |
Other Names | BER130 BG41114 Q3-90 Q300050090 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Elastomer |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Black 21.84mm x 18.79mm Rectangular |
Color | Black |
Backing, Carrier | Fiberglass |
Adhesive | - |