In stock: 51043
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Standard Packaging Integrated Circuit Components Q3-0.005-00-67
Usage | Power Module |
---|---|
Type | Pad, Sheet |
Thickness | 0.0050" (0.127mm) |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 2.0 W/m-K |
Shape | Rectangular |
Series | Q-Pad® 3 |
Outline | 38.10mm x 22.86mm |
Other Names | BER136 BG41113 Q3-67 Q300050067 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Elastomer |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Black 38.10mm x 22.86mm Rectangular |
Color | Black |
Backing, Carrier | Fiberglass |
Adhesive | - |