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Standard Packaging Integrated Circuit Components PA-SOTD3SM18-06
Size / Dimension | 0.450" L x 0.350" W (11.43mm x 8.89mm) |
---|---|
Series | - |
Proto Board Type | SMD to DIP |
Pitch | 0.037" (0.95mm) |
Package Accepted | SOIC |
Other Names | 309-1099 PASOTD3SM1806 |
Number of Positions | 6 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Board Thickness | - |