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Standard Packaging Integrated Circuit Components PA-SSD3SM18-16
Size / Dimension | 0.850" L x 0.450" W (21.59mm x 11.43mm) |
---|---|
Series | - |
Proto Board Type | SMD to DIP |
Pitch | 0.026" (0.65mm) |
Package Accepted | SSOP, TSSOP |
Other Names | 309-1129 PA-SSD3DM18-16 PA-SSD3SM18-16-ND Q6444593 |
Number of Positions | 16 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | - |
Manufacturer Standard Lead Time | 7 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Board Thickness | - |