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Standard Packaging Integrated Circuit Components SI5858DU-T1-GE3
Vgs(th) (Max) @ Id | 1V @ 250µA |
---|---|
Vgs (Max) | ±8V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | PowerPAK® ChipFet Dual |
Series | LITTLE FOOT® |
Rds On (Max) @ Id, Vgs | 39 mOhm @ 4.4A, 4.5V |
Power Dissipation (Max) | 2.3W (Ta), 8.3W (Tc) |
Packaging | Tape & Reel (TR) |
Package / Case | PowerPAK® ChipFET™ Dual |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 520pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs | 16nC @ 8V |
FET Type | N-Channel |
FET Feature | Schottky Diode (Isolated) |
Drive Voltage (Max Rds On, Min Rds On) | 1.8V, 4.5V |
Drain to Source Voltage (Vdss) | 20V |
Detailed Description | N-Channel 20V 6A (Tc) 2.3W (Ta), 8.3W (Tc) Surface Mount PowerPAK® ChipFet Dual |
Current - Continuous Drain (Id) @ 25°C | 6A (Tc) |