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Standard Packaging Integrated Circuit Components SI7884BDP-T1-GE3
Vgs(th) (Max) @ Id | 3V @ 250µA |
---|---|
Vgs (Max) | ±20V |
Technology | MOSFET (Metal Oxide) |
Supplier Device Package | PowerPAK® SO-8 |
Series | TrenchFET® |
Rds On (Max) @ Id, Vgs | 7.5 mOhm @ 16A, 10V |
Power Dissipation (Max) | 4.6W (Ta), 46W (Tc) |
Packaging | Cut Tape (CT) |
Package / Case | PowerPAK® SO-8 |
Other Names | SI7884BDP-T1-GE3CT |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 3540pF @ 20V |
Gate Charge (Qg) (Max) @ Vgs | 77nC @ 10V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
Drain to Source Voltage (Vdss) | 40V |
Detailed Description | N-Channel 40V 58A (Tc) 4.6W (Ta), 46W (Tc) Surface Mount PowerPAK® SO-8 |
Current - Continuous Drain (Id) @ 25°C | 58A (Tc) |