In stock: 63
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Standard Packaging Integrated Circuit Components A16367-08
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0800" (2.032mm) |
Thermal Resistivity | - |
Thermal Conductivity | 3.0 W/m-K |
Shape | Rectangular |
Series | Tflex™ SF600 |
Outline | 228.60mm x 215.90mm |
Other Names | 926-1339 A1636708 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Non-Silicone, Boron Nitride Filled |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Pink 228.60mm x 215.90mm Rectangular |
Color | Pink |
Backing, Carrier | - |
Adhesive | - |