Label and body marking of A16367-05 can be provided after order.
In stock: 56089
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Standard Packaging Integrated Circuit Components A16367-05
Usage | - |
---|---|
Type | Gap Filler Pad, Sheet |
Thickness | 0.0500" (1.270mm) |
Thermal Resistivity | - |
Thermal Conductivity | 3.0 W/m-K |
Shape | Rectangular |
Series | Tflex™ SF600 DF |
Outline | 215.90mm x 228.60mm |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Non-Silicone, Boron Nitride Filled |
Manufacturer Standard Lead Time | 4 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Pink 215.90mm x 228.60mm Rectangular Tacky - One Side |
Color | Pink |
Backing, Carrier | - |
Adhesive | Tacky - One Side |