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Standard Packaging Integrated Circuit Components EPC2101
Vgs(th) (Max) @ Id | 2.5V @ 3mA, 2.5V @ 12mA |
---|---|
Supplier Device Package | Die |
Series | eGaN® |
Rds On (Max) @ Id, Vgs | 11.5 mOhm @ 20A, 5V, 2.7 mOhm @ 20A, 5V |
Power - Max | - |
Packaging | Tape & Reel (TR) |
Package / Case | Die |
Other Names | 917-1181-2 |
Operating Temperature | -40°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 14 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 300pF @ 30V, 1200pF @ 30V |
Gate Charge (Qg) (Max) @ Vgs | 2.7nC @ 5V, 12nC @ 5V |
FET Type | 2 N-Channel (Half Bridge) |
FET Feature | GaNFET (Gallium Nitride) |
Drain to Source Voltage (Vdss) | 60V |
Detailed Description | Mosfet Array 2 N-Channel (Half Bridge) 60V 9.5A, 38A Surface Mount Die |
Current - Continuous Drain (Id) @ 25°C | 9.5A, 38A |