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Standard Packaging Integrated Circuit Components EPC2100ENG
Vgs(th) (Max) @ Id | 2.5V @ 4mA, 2.5V @ 16mA |
---|---|
Supplier Device Package | Die |
Series | eGaN® |
Rds On (Max) @ Id, Vgs | 8.2 mOhm @ 25A, 5V, 2.1 mOhm @ 25A, 5V |
Power - Max | - |
Packaging | Tray |
Package / Case | Die |
Other Names | 917-EPC2100ENG EPC2100ENGR_H1 EPC2100ENGRH1 |
Operating Temperature | -40°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 475pF @ 15V, 1960pF @ 15V |
Gate Charge (Qg) (Max) @ Vgs | 4.9nC @ 15V, 19nC @ 15V |
FET Type | 2 N-Channel (Half Bridge) |
FET Feature | GaNFET (Gallium Nitride) |
Drain to Source Voltage (Vdss) | 30V |
Detailed Description | Mosfet Array 2 N-Channel (Half Bridge) 30V 10A (Ta), 40A (Ta) Surface Mount Die |
Current - Continuous Drain (Id) @ 25°C | 10A (Ta), 40A (Ta) |