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Standard Packaging Integrated Circuit Components EPC2012CENGR
Voltage - Test | 100pF @ 100V |
---|---|
Voltage - Breakdown | Die Outline (4-Solder Bar) |
Vgs(th) (Max) @ Id | 100 mOhm @ 3A, 5V |
Technology | GaNFET (Gallium Nitride) |
Series | eGaN® |
RoHS Status | Tape & Reel (TR) |
Rds On (Max) @ Id, Vgs | 5A (Ta) |
Polarization | Die |
Other Names | 917-EPC2012CENGRTR |
Operating Temperature | -40°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Part Number | EPC2012CENGR |
Input Capacitance (Ciss) (Max) @ Vds | 1nC @ 5V |
Gate Charge (Qg) (Max) @ Vgs | 2.5V @ 1mA |
FET Feature | N-Channel |
Expanded Description | N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar) |
Drain to Source Voltage (Vdss) | - |
Description | TRANS GAN 200V 5A BUMPED DIE |
Current - Continuous Drain (Id) @ 25°C | 200V |
Capacitance Ratio | - |